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Tsmc 7nm density

(NASDAQ: CDNS) today announced its collaboration with TSMC to advance 7nm FinFET Plus design innovation for mobile and high-performance computing (HPC) platforms. It has also revealed that it has developed two Samsung/GlobalFoundries and TSMC are way ahead when it comes to transistor density (MTr/mm²) at 52. Michael Wu of TSMC presented a paper that had over 30 authors. While some claim that the node designation of "7 nm" has no physical meaning beyond marketing purposes, others point to transistor density as the TSMC became the world’s first semiconductor company that begins 20nm volume production, using its innovative double patterning technology, in 2014, and made record of TSMC…The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. Based on company statements (TSMC 5nm a 1. Packing these into less space means better TSMC and GloFo 16/14/12nm => TSMC 7nm allows up to 3-4× increased density, but it also limited by W/mm², and the clocks they want to run the chip on. Advertisment. 76. 12, 2018 3:56 PM ET | Intel's 10nm chips are similar to TSMC's 7nm chips in terms of density, and in the past, Intel has offered a processing advantage. It is expected to be necessary for the upcoming 10 nm and 7 nm node semiconductor processes and beyond. 7nm Tool Certification. Highlights: Synopsys Design Platform is certified by TSMC for 7-nm FinFET Plus process technology, with customer deployment on multiple designs IC Compiler II optimized for EUV lithography-aware Meanwhile, its competitors, like TSMC, are beginning high volume manufacturing of 7nm alternatives. Apple chipmaker TSMC and chip designer ARM have announced that they will work together to create a 7nm FinFET process expected to enter early production in late 2017 and mass production in 2018 Even Samsung does not project full confidence in their 7nm by introducing an 8nm process which shares many of the core technologies as their 7nm – offering marginal density and performance advantage. We do not know much regarding the difference between the 7nm and the 7nm+ process but what we can tell you is that the new process (TSMC 7nm UEV design) will offer a 20% higher transistor density TSMC’s 7nm process offers twice the transistor density compared to the 14nm process. Cadence digital implementation and signoff tools have been certified by TSMC for both the 7nm FinFET Plus and 7nm processes, and process design kits (PDKs) are immediately available for download. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. 3 respectively for their 10nm nodes while Intel only manages 43. TSMC set another industry record by launching two separate 7nm FinFET tracks: one optimized for mobile applications, the other for high-performance computing applications. GlobalFoundries 7nm TSMC 7nm process technology and CoWoS technologies combined with Broadcom's IP cores and ASIC design methodology continues to enable best-in-class custom solutions for the end customers," said Dr TSMC, one of the biggest chip suppliers to Apple, on its website promises faster speed and up to 40% power reduction. 8x higher transistor density TSMC Kicks Off Volume Production of 7nm Chips · TSMC Starts to Build Oct 9, 2018 By contrast, TSMC's second-generation 7 nm manufacturing a 20% higher transistor density (because of tighter metal pitch) and ~8% lower Sep 11, 2018 AMD late last month said it would shift its 7 nm business, including the Zen 2 CPU and the Navi GPU to TSMC (the Taiwan Semiconductor TSMC's 7nm process density is 1. The design win was enabled by the power and performance profile of TSMC’s 7nm process technology. 7nm refers to the width of the transistor gate that is the most basic component of the mobile phone processor. TSMC used Copper for their 7nm, but will go with the Cobalt/Copper hybrid with 7nm+ & EUV, I believe. Combined with the double whammy of 7nm Eypc servers from AMD it seems like Intel's technical offerings are rapidly getting commoditized by the rest of the market. Originally it would be about the same density, but the feature sizes have been relaxed to get it working. Arm and Samsung Foundry this week announced plans to extend their collaboration to 7LPP and 5LPE process technologies. TSMC's 256-Mbit SRAM test chip has a cell density of 0. AMD will also reveal more about the 7nm Mi60 Instinct GPU for the data center. For contrast Global Foundries mention for 7LP 40% more speed or uses 60% less power, density a bit less than TSMC; GF product brief spec goes back to late 2017 but still dated 2018 so would seem accurate. In short, the foundry 7nm node is similar to the Intel 10nm in capabilities and, for TSMC, in schedule. Actually 7nm is ~2. Not only is 7nm expensive, thanks to multi-patterning that's needed to enhance feature density of integrated circuits at 7nm and beyond, but the departure of GlobalFoundries from the 7nm scene TSMC also unveiled some low power and low leakage processes that are suitable for Apple's other custom designs, such as its line of wireless chips like the W1 and successor W2. Cadence delivered a fully integrated digital implementation and signoff tool flow, which has been certified by TSMC for the latest versions of the 5nm and 7nm+ processes. In what is essentially the corporate version of a fist-bump of solidarity, ARM and TSMC have agreed to join forces to develop a 7nm chip. The premise is that a single lithographic exposure may not be enough to provide sufficient resolution. Multiple patterning (or multi-patterning) is a class of technologies for manufacturing integrated circuits (ICs), developed for photolithography to enhance the feature density. For the same performance level, power is reduced by about 50 percent Currently, TSMC's new 7nm chips deliver 35 percent more speed or uses 65 percent less power and sports a 3x gain in routed gate density. The company is working on the new chipset along with Taiwan Semiconductor Company (TSMC) and it is expected that the chipset will debut in Q1 of 2019 in India. Earlier this month, TSMC announced risk production of the technology for a future version of its 7nm node, which will go into production next year. To view blog comments and experience other SemiWiki features you must be a registered member. 8 and 60. 8 times, and performance is expected TSMC’s 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry’s most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM with double-digit yields in June 2016. Intel argues that the traditional way of calculating density improvements needs to be replaced with a metric that combines NAND and scan flip-flop densities. 43X chip area scaling over its prior 16nm technology, and its 16nm technology provided a rough doubling in transistor density over its A seemingly innocuous statement published about TSMC’s new 7nm FinFet fabrication process on its website could have spilled the beans on Apple’s future plans for its ARM-based A-series chips. 027mm^2 in both GF's and TSMC's, almost 3x density improvement. TSMC's 7nm process yields about 83 million transistors per mm^2 [wikipedia. TSMC's 7nm process density is 1. • Likely cobalt filled vias and contacts. The integrated flow ensures that the In addition, Mentor Graphics has certified its Calibre Platform, its Nitro-SoC place and route (P&R) Platform, and its AFS Platform for the TSMC 7 nm V1. While some claim that the node designation of "7 nm" has no physical meaning beyond marketing purposes, others point to transistor density as the TSMC became the world’s first semiconductor company that begins 20nm volume production, using its innovative double patterning technology, in 2014, and made record of TSMC…Samsung Unveils Scaling, Packaging Roadmaps Foundry unit rolls out ambitious plan down to 4nm, along with 18nm FD-SOI and advanced packaging developments. As such you would expect a 7nm device to be worse than a 10nm (at least on channel resistance), and only to be better if you can pack more fins into the same space. In semiconductor manufacturing, the International Technology Roadmap for Semiconductors defines the 7 nanometer (7 nm) node as the technology node following the 10 nm node. For 10nm, Intel reports a bitcell size of . We are working closely with both foundry partners, and will have different product lines for each. TSMC’s 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry’s most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM with double-digit yields in June 2016. "TSMC is pleased to work closely with Mentor, which continues to increase its value to the TSMC ecosystem by offering more features to its tool flow in support of our new 12nm and 7nm FinFET Plus processes," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. 08mm^2 in GF's 14nm, 7nm promises 0. Granted, GloFo seems to be planning to skip 7 nm and go straight to 5 nm but we will see how this goes. Cadence digital, signoff and custom/analog tools achieve latest DRM and SPICE certifications for TSMC 5nm and 7nm+ process technologies Early customers using Cadence tools for 5nm design projects We have already taped out multiple 7nm products at TSMC, including our first 7nm GPU planned to launch later this year and our first 7nm server CPU that we plan to launch in 2019. Taiwan Semiconductor Manufacturing Company ("TSMC") has quickly become a household name in the chip fabrication business, and the foundry of choice for many fabless chip makers. That news came from 'people familiar with …New 7nm FinFET Plus Tool Certification and 7nm Flow Enhancements Cadence digital implementation and signoff tools have been certified by TSMC for both the 7nm FinFET Plus and 7nm processes, and process design kits (PDKs) are immediately available for download. Mark Papermaster will cover the new Zen 2 cores and AMD's 7nm process technology. 6x. A month ago it was reported that one of the first 7nm processors, the Apple A12, was in mass production at TSMC in Taiwan. Read the latest news and Press about Mentor, a Siemens Business. 5 V. These feature sizes are similar not only to TSMC’s 7nm process, but also to Intel’s 10nm process , which is roughly equivalent to what the foundries refer to as 7nm. Minimum metal pitch is 40 nm, as reported at IEDM 2016. Indeed, Intel will ramp a true foundry 7nm process in 2017, only matched by TSMC in 2018. AMD CEO Dr. Referencing a SemiWiki article, “Exclusive — GLOBALFOUNDRIES discloses 7nm process detail,” published on 7/8/2017, the contacted poly pitch (CPP) ranges from 54nm to 57nm across TSMC, Samsung and GLOBALFOUNDRIES at 7nm with 6T SRAM high-density cell sizes that range from 0. my issue is if they can scale 7nm to bigger chips. It won’t be the world’s first – IBM created a 7nm Topic Posted By Date; TSMC started fabbing Apple's 7nm A12, Samsung confirms 7nm start this year: AM: 2018/05/24 04:08 AM Pick a number, any number at all Contract chipmaker Taiwan Semiconductor Manufacturing Company (NYSE: TSM) has been on a roll over the last several years, bringing out new manufacturing technologies and subsequent enhancements ARM and TSMC Announce Multi-Year Agreement to Collaborate on 7nm FinFET Process Technology for High-Performance Compute 15 March 2016 Hsinchu, Taiwan and Cambridge, UK, March. iPhone 8 Chipset – ARM and TSMC recently announced that they are working on a 7nm FinFET process technology. , and SINGAPORE, Nov. TSMC debuts Wafer-on-Wafer tech, 7nm node at volume production, 7nm+ and 5nm nodes on track Published: Maio 9, 2018 Taiwan Semiconductor Manufacturing Company (“TSMC”) has quickly become a household name in the chip fabrication business, and the foundry of choice for many fabless chip makers. Due to difficulties in the use of EUV, TSMC is starting it off with second-generation 7nm first. . That means that TSMC's 7nm isn't entirely on par with Intel's 10nm process. As far as I can tell the 7nm is the fin width, and not the fin pitch or the channel length (which is what used to be measured). TSMC and Samsung might be about half a year earlier to market, but besides the solid density lead, Intel should have a very solid performance and power advantage too. 28. Feb. At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications. Lisa also said AMD has confidence in TSMC. 4x shrink of 10nm), TSMC's 5nm is expected to have a density of ~147MTr/mm2, compared to Intel's 7nm with 242MTr/mm2. EETimes reports that TSMC is claiming a 1. It had revenues of $100 million last year and has 120 employees. Then you have Intel 10nm node density at 100. 8x as dense as 14nm and ~3. 2 times more, all compared with 16-nanometer. 7, “A 7nm Platform Technology Featuring 4th Generation FinFET Transistors with a 0. IEDM this year was its usual mixture of academic exotica and industrial pragmatica (to use a very broad-brush description), but the committee chose to keep us all waiting until the Wednesday morning before we got to the CMOS platform papers. Cobalt seems to be the one consistent problem for everyone. Under the terms of the agreement, Arm will offer Samsung Foundry customers globalfoundriesの7nmプロセスがamdを加速する amdで世界で初めての7nmプロセスgpuとして「vega」アーキテクチャのgpuを投入しようとしている。By Dick James. We intend to make 7nm a very long lived node like 28nm and 16nm. 027μm². Numerous In other words: 7nm is expensive, it's cheaper and easier to improve the performance and density of 12nm, and hardware accelerators and custom chips built by GlobalFoundries for its customers don Apple’s new lineup of iPhones arrives this fall, and the Cupertino company’s supplier, TSMC, has already started mass production of the processors that will power these handsets. TSMC’s 7nm process offers twice the transistor density compared to the 14nm process. The company Cadence digital implementation and signoff tools have been certified by TSMC for both the 7nm FinFET Plus and 7nm processes, and process design kits (PDKs) are immediately available for download. Key to this is TSMC’s 7nm process, which offers twice the transistor density of the 14nm process the original Zen parts used. Nevertheless, as of 2017, the technological race to the greatest density was still competitive between the main players, with TSMC, Samsung, and Intel all holding leading positions between the years 2016 and 2017 when measured by the smallest feature size on chip. 8x higher transistor density TSMC Kicks Off Volume Production of 7nm Chips · TSMC Starts to Build Oct 9, 2018 By contrast, TSMC's second-generation 7 nm manufacturing a 20% higher transistor density (because of tighter metal pitch) and ~8% lower Apr 24, 2018 TSMC expects its CLN7FF+ to offer a 20% higher transistor density and a 10% TSMC is on track to start HVM using its 7 nm EUV process TSMC detailed its 7-nm advances over its 16FF+ process (Images: IEDM). 0. Hspice results show that the power density of each 7nm FinFET circuit is at least 10 to 20 times larger than that of the same 45nm TSMC is considered superior to GloFo in terms of performance and density. The non-EUV DUV 7nm multi-patterning process cost is higher relative to the TSMC 7+ EUV, so would influence its use. Due to the refined process, TSMC is expecting about 6-12% reduction in power consumption and 20% increase in density. Cadence provides a fully integrated and stable TSMC 7nm flow, from implementation to final signoff. For more information on this program . 25 which is another node down from 7nm. Intel is going to completely rework their metal layers for 10nm++ (Tigerlake & Sapphire Rapids). Indeed, Intel will ramp a true foundry 7nm process in 2017, only matched by TSMC …TSMC’s 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry’s most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM with double-digit yields in June 2016. Along with the updated 7nm+ process, the company is also planning out their A month ago it was reported that one of the first 7nm processors, the Apple A12, was in mass production at TSMC in Taiwan. After N7+ comes TSMC’s first-generation 5 nm (CLN5FF, N5) course of, which can use EUV on as much as 14 layers. AMDで世界で初めての7nmプロセスGPUとして「Vega」アーキテクチャのGPUを投入しようとしている。すでに実チップはできあがり、サンプリング中で Part 1 of Dick James’ preview can be read here. 8 times, and performance is expected to increase by 15%. Single transistor 7 nm scale devices were first produced in the early 2000s. One source pegged total costs for an N5 design including labor and licensing at $200 to $250 million, up from $150 million for a 7-nm chip today, limiting pursuit of Moore's Law to the well-heeled. tsmc 7nm densityIn semiconductor manufacturing, the International Technology Roadmap for Semiconductors In March 2017, TSMC announced 7 nm with EUV (N7FF+) risk production starting . At the same time, they are racing each other to ship the next technologies on the roadmap—10nm and 7nm. 28nm GPUs are ~13-15mtrans/mm^2 for reference so 16/14nm is less than a double density increase. Earlier this year, in April, TSMC, which is the world’s largest contract chipmaker, had confirmed that the company has started mass-producing 7-nanometer processors but didn’t disclose if the Huawei working on Kirin 990 SoC. This forced GloFo to abandon their 7nm which once again screwed AMD, forcing them to switch to TSMC. In addition to the tools certified for TSMC's 7nm FinFET Plus and 7nm process technologies, the Virtuoso Liberate Characterization Solution and the Virtuoso Variety Statistical Characterization Solution have been validated to deliver accurate Liberty libraries including advanced timing, noise and power models for the 7nm FinFET Plus process. 7nm Tool CertificationTSMC and Cadence have collaborated on an integrated flow based on tool certification targeting TSMC's 7nm mobile and HPC platforms. The process will deliver “more than three times the gate density and either a speed gain (35-40%) or power reduction (>65%) versus the company’s commercial 16nm FinFET process,” the abstract said. Session 28: Memory Technology – In-memory Computing. May 02, 2018 · TSMC N7+ will get to market by H2 2019 overtaking Intel 10nm in density. 0 process, which offers a 3x density improvement, 30% better performance, and 60% lower power than the 16 nm FF process. “TSMC’s 7nm is expected to account for more than 20 percent of the company’s revenue in the December quarter as the customer mix includes more than 50 Last week, TSMC made two important announcements concerning its progress with extreme ultraviolet lithography (EUVL). Screenshot used courtesy of AMD. It is a joke, not a real 7nm process. Nevertheless, as of 2017, the technological race to the greatest density was still competitive between the main players, with TSMC, Samsung, TSMC's 7nm process density is 1. 074 mm^2 in their 16nm, 1. . This will bring some nice density improvements in the area of 17%. Recent semiconductor node naming conventions aren't based on traditional measurements, so they're more of a marketing exercise than a science-based metric. GlobalFoundries expect their first 7nm products to be reaching mass volume production towards the end of 2018 and into the beginning of 2019 – no doubt AMD’s 7nm Vega will be making up the AMD's Zen2, which should come in or around 2019, will be on GloFo's 7nm. Intel went 14 > 10. Unfortunately, costs are increasing, too. 651 Careful there, there's no real standard for what "10nm" or "7nm" means across manufacturers. May 8, 2018 TSMC's 5 nm (CLN5) technology will increase the usage of EUV tools it comes to transistor density: TSMC is touting a 1. Material published as "Partner Content" was created by or on behalf of ASPENCORE's partner(s) in conjunction with the ASPENCORE Studio team and may not reflect the views of the site and editors to which it is published. 7nm in general will deliver 3. However, because of the vague way that new process nodes are named these days (just try finding something that actually measures 7nm on a “7nm” FPGA), it isn’t really clear what the value difference (density, performance, power) will be between TSMC 7nm and Intel 10nm. Intel needs to shrink its 10nm process by a factor of 0. 6x. But it does look like TSMC 7nm ~= Intel 10nm in terms of density. The Taiwan Semiconductor Manufacturing Company, better known as TSMC, is holding its 24 th annual Technology Symposium in Santa Clara right now, and it’s just unveiled a process that could spell Multiple patterning (or multi-patterning) is a class of technologies for manufacturing integrated circuits (ICs), developed for photolithography to enhance the feature density. Following multiple delays, the first server CPUs based on Intel's 10nm node, which is seen as competitive with TSMC's 7nm node, aren't expected until 2020. Samsung/GlobalFoundries and TSMC are way ahead when it comes to transistor density (MTr/mm²) at 52. 3x increased router gate density and a trade From a general PPA (power, performance, area) improvement point of view, TSMC expects its CLN7FF+ to offer a 20% higher transistor density and a 10% lower power consumption at the same complexity TSMC's 10 nm process offers the highest transistor density. The chipset is expected get its mass production in 2018, so we can expect to see it in the iPhone 8. At the same time, 7nm offers a substantial density improvement, performance improvement and power reduction from So HD SRAM cell size on TSMC 7nm is 0. Through close collaborations with TSMC and customers, Cadence began developing IP on the 7nm process last year. • 7nm (9. 3 respectively for their 10nm nodes while Intel only manages 43. The development of a 7nm process would move the work the two companies have done together from mobile systems-on-a-chip (SoCs) to data centers and next-generation networks, according to officials Key to this is TSMC’s 7nm process, which offers twice the transistor density of the 14nm process the original Zen parts used. Published by Chinatimes, TSMC has officially begun mass production of their 7nm node at their Fab 15. That news came from 'people familiar with the matter', anonymous industry GlobalFoundries’ transistor density is projected using the 7nm transistor density while using TSMC’s projected improvement as a proxy. FEOL covers wafer production, lithography, etch, and deposition. A 7nm CMOS Platform Technology Using EUV Lithography will be disclosed by the IBM/Globalfoundries/Samsung technology development alliance. Physical Design Challenges and Innovations to Meet Power, Speed, and Area Scaling Trend Fin depopulation to increase cell density 7nm 2 fins 70% 75% 1. Over the past 12 months, the foundry’s position has been weakened, thanks to Samsung’s The 7nm high-density SRAM cell measures . In paper 2. "Partner Content" allows today's industry thought leaders to share their unique insight and perspective with the greater ASPENCORE audience. tsmc 7nm density For example, Cadence introduced an accelerated custom placement and routing methodology, which enables customers to improve productivity and meet their power, multiple patterning, density and EM requirements. 8 and 60. Apple automotive electronics foundry demand IT components, peripherals IC IC manufacturing AI Mobile components 5G TSMC innovation semiconductor PCB China Solar manufacturing 2018 IC design The TSMC reliability offering leverages the Calibre PERC™ reliability verification solution, now with enhanced techniques for 10nm resistance and current density checking. Nevertheless, as of 2017, the technological race to the greatest density was still competitive between the main players, with TSMC, Samsung, Sep 11, 2018 AMD late last month said it would shift its 7 nm business, including the Zen 2 CPU and the Navi GPU to TSMC (the Taiwan Semiconductor TSMC’s 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry’s most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM with double-digit yields in June 2016. The integrated flow ensures that the Cadence delivered several custom/analog enhancements specifically to support the TSMC 5nm and 7nm+ process technologies. 0262μm² and . TSMC 7nm process technology and CoWoS technologies combined with Broadcom’s IP cores and ASIC design methodology continues to enable best-in-class custom solutions for the end customers,” said Dr. transistor density of N5 is ~1. 82, TSMC 10nm node density was 52. The Kirin 990 will be manufactured using the second-generation 7nm process node technology of the Taiwanese foundry TSMC, and HiSilicon, the semiconductor subsidiary of Chinese tech giant Huawei Chip producer TSMC may enjoy its highest profits this year for production of the next-generation "A12" processor, with a report claiming the manufacturer is ramping up volume production on its 7nm Cadence delivered several custom/analog enhancements specifically to support the TSMC 5nm and 7nm+ process technologies. iwod - Sunday, July 08, 2018 - link From all the preliminary data we have, the ARM A76 is actually pretty good performance considering how little transistor it uses compare to Apple's implementation. The smallest high-density SRAM cell measures 0. Transistor Options Beyond 3nm Complicated and expensive technologies are being planned all the way to 2030, but it's not clear how far the scaling roadmap will really go. 53x or better to maintain density leadership. this week disclosed some additional details about its 7nm fabrication process. This is an upgraded form of 7nm and features high performance transistors that guarantee a 5% speed gain over basic 7nm. In addition, these advances require use of new standard cells. Sep 26, 2016 · Linearly yes but that is two full nodes when you look at the square of the linear shrink which is what the numbers represent. For the same performance level, power consumption is reduced or inversely, at the same power consumption, performance takes a hike. AMDで世界で初めての7nmプロセスGPUとして「Vega」アーキテクチャのGPUを投入しようとしている。すでに実チップはできあがり、サンプリング中で By Dick James. Wednesday. TSMC described a 256-Mbit SRAM test chip with the cell density of 0. Longer lived and more variants for Samsung. Intel's 10nm is comparable to the others "7nm", and Intel's is usually smaller in most things, unlike the others that base their marketing name on one thing like Gate size or something. TSMC's Push To AI. TSMC and Mentor are expanding use of the SmartFill functionality and Calibre multi-patterning capabilities to support the technology requirements of 7nm. TSMC's 7nm proceess yields 6. The silicon foundry business is heating up, as vendors continue to ramp their 16nm/14nm finFET processes. TSMC adopted a similar strategy when it unveiled a 7nm 256Mb SRAM test chip at last year's conference, comparing it to its current 16nm process rather than what it says will be a "short-lived The abstract echoed claims for the 7nm node that TSMC first made at an event here in September. At the same time, 7nm offers a substantial density improvement, performance improvement and power reduction from Combining this breakthrough layout technique with the benefits of TSMC's prime-part 7nm procedure technology, "Zen 2" can provide huge functionality, power consumption and density generational advancements that can aid in the reduction of datacenter working prices, carbon footprint and cooling necessities. 10 am. • TSMC is shipping 10nm, with 7nm in risk production. According to BJ, some nodes at TSMC come and go, and othes are much longer lasting: N7 will be another strong node at TSMC. Combining this breakthrough design methodology with the benefits of TSMC’s leading-edge 7nm process technology, “Zen 2” delivers significant performance, power consumption and density generational improvements that can help reduce datacenter operating costs, carbon footprint and cooling requirements. 027µm2 High-Density 6-T SRAM Cell for Mobile SoC Applications,” S. N7+ is the second generation of N7 with EUV on selected layers. Key to this is TSMC's 7nm process, which offers twice the transistor density of the 14nm process the original Zen parts used. TSMC claims their 7nm process will deliver a 20% performance improvement and a 40% reduction in power consumption. 25 on Tuesday. The only CPU that AMD has in their pipeline and uses 7nm process is the upcoming Zen 2 architecture which will be a big leap for the company in terms of performance and efficiency. TSMC has hit volume production for 7nm product, and AMD is expected to take advantage of it in 2018 with Radeon Vega and EPYC 2. It looks like the setting for a liquidity event. GloFo's 7nm was going be with expensive with low yields for a while. 0270um 2. A free online environment where users can create, edit, and share electrical schematics, or convert between popular file formats like Eagle, Altium, and OrCAD. 49/196 = 1/4 or . TSMC has revealed that its new 7nm FinFet process will deliver mobile chips that are at least 20 percent faster and 40 percent more efficient. 9 billion transistors on 100 mm^2, or 69 million transistors per mm^2. “If the performance advantages are marginal, AMD will have to rely on product differentiation (memory density, PCI channels, etc. Lisa Su: So in 7nm, we will use both TSMC and GlobalFoundries. TSMC reiterated plans to start qualifications of the technology in early 2017 Due to the refined process, TSMC is expecting about 6-12% reduction in power consumption and 20% increase in density. At the 5nm node, TSMC will invest $25 billion to develop the 5nm process. 7x density improvement High density SRAM cell is 0. TSMC/Samsung 7nm is actually "7nm", pure marketing unlike Intel's name for their nodes. 6x shrink from 16FF+ (0. Cadence library characterization tool flow supports 7nm FinFET Plus and 7nm processes; Cadence Design Systems, Inc. The title was A 7nm CMOS Platform Technology Featuring 4th Generation FinFET Transistors with a 0. Posted on Oct 10th 2018, 8:09 Reply #18 WikiFM Until we know the metrics of TSMC's 7+ nm we are not sure if it is comparable or better than Intel's 10 nm or still behind, like 7 nm. By contrast the N7+ node with EUV will only deliver 20 percent more density, 10 percent less power and apparently no speed gains. I've started comparing based on transistor density, rather than process size, to avoid this stupid apples to oranges nm comparison where one company's nm means something completely different from another company's nm. TSMC N5 will get to market by H2 2020 and TSMC N3 by H2 2022. For more information on this program TSMC’s 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry’s most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM with double-digit yields in June 2016. Apple’s key supplier TSMC is it looks like Apple will go from 10 nm in the A11 Bionic chip to 7nm in the A12 chip. Samsung and TSMC both use hybrid nodes at 14/16nm, though Samsung’s 14nm is actually based on an unreleased 20nm die-shrink. The TSMC 5nm node uses a FinFET transistor like their 7nm process, but it makes more extensive use of EUVL. TSMC’s basic 7nm node has entered volume production and the fab expects to deliver at least 50 tapeouts by the end of this year. I think Intel has no chance of regaining density lead for atleast 5 years. today announced its continued collaboration with TSMC to further 5nm and 7nm+ FinFET design innovation for mobile and high density and EM requirements. 51. TSMC and Cadence have collaborated on an integrated flow based on tool certification targeting TSMC’s 7nm mobile and HPC platforms. 2nm which means TSMC will regain the lead in the first half of 2018 and remain in the lead until Intel and Samsung hit 7nm in the 2019-2020 time frame. 027 mm2 with full read/write capabilities down to 0. TSMC said the 7nm process will deliver either a 40 percent boost in performance or a 65 percent reduction in power at the transistor level compared to the current 16nm FinFET process. Cadence digital and signoff tools optimized for TSMC’s 5nm and 7nm+ process provide EUV support at key layers and associated design rules that enable customers to achieve power, performance and area (PPA) savings at these advanced nodes. But if they reach ~5nm then they'll likely be knocking on Intel's 10nm door. Although their naming differs, our analysis shows that the foundries’ 7nm technologies are close to Intel’s 10nm in density and likely better in cost per transistor, although Intel appears to lead in raw transistor speed. 8x shrink of 7nm, and Intel 7nm a 2. SAN JOSE, Calif. Samsung, TSMC and GloFo are all doing smaller steps. 1 looks at the modeling-based design of brain-inspired spiking neural networks with RRAM learning synapses. Apple supplier TSMC has started mass production on the processors for this year's lineup of new iPhones, according to Bloomberg. Globalfoundries 7nm LP FinFET process could prove to be beneficial for some of Globalfoundries biggest customers like AMD who need the highest performance and density logic and cache memories. • Samsung is shipping 10nm, with plans to develop 8nm, 7nm and 6nm. The integrated flow ensures that the certified tools work The 7nm node (referred to as CLN7FF, 7FF, or simply N7) is expected to have an approximate 40 percent power and area benefit over TSMC's 10nm FinFET process, utilized in Apple's A11 processors. Not only 7nm is expensive, thanks to multi-patterning that's needed to enhance feature density of integrated circuits at 7nm and beyond, but the departure of GlobalFoundries from the 7nm scene Jack Sun, TSMC’s vice president of research and development and chief technology officer, said the 7nm process node will offer significant enhancements in speed, power, and device density. This will allow tangible enhancements in phrases of density, however would require TSMC to extensively use EUV gear. TSMC 7nm is rated by the ASML formula at 8. 1 day ago · Achronix is moving ahead at a terrific clip – its 7nm eFPGA core is out today, its 7nm FPGA chip will be out in Q1. As it stands, TSMC will use a combination of EUV and conventional lithography for different masking layers, increasing the EUV proportion as the manufacturing is refined. Most of the sessions Wednesday morning are limited to five papers, since we have a second plenary session (30) at 11. It was rumored TSMC's 7nm wouldn't be the same as Intel's 10nm. For 2018, it looks like Apple will go from 10 nm in the A11 Bionic chip to 7nm in the A12 chip. 7nm Tool Certification TSMC and Cadence have collaborated on an integrated flow based on tool certification targeting TSMC's 7nm mobile and HPC platforms. 6X compared to their 10nm process. “TSMC is pleased to work closely with Mentor, which continues to increase its value to the TSMC ecosystem by offering more features to its tool flow in support of our new 12nm and 7nm FinFET Plus processes,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. • Intel will ramp up 10nm finFETs by year’s end, with 7nm and 5nm in R&D. Now that we're in Q2, TSMC's co-CEO CC Wei spoke with reporters yesterday and revealed that TSMC's 7nm process technology in terms of performance, power and area density as well as its schedule is The first 7nm chip is the ASIC bitcoin chip. 6X compared to their 10nm process. Cadence Design Systems, Inc. So Intel's 7mm actually competes with TSMC's 3nm. Risk production started in April 2017. In the past, others tended to have better density, but came later than Intel 45nm: K-L Cheng (TSMC), 2007 IEDM, p. As a result of greater EUV usage TSMC plans to move to 7nm in 2018 Demand is growing for increasingly advanced process technologies, whether it is to reduce the cost of manufacturing, increase circuit density, increase performance or decrease power consumption. When compared to TSMC’s N7, N5 technology will enable TSMC's customers to shrink area of their designs by ~45% (i. 027um2 High Density 6-T SRAM Cell for Mobile SoC Applications. “Compared to its 10nm FinFET process, TSMC’s 7nm FinFET features 1. Processors, graphics processing units, and field-programmable gate arrays will benefit from 7nm technology, along with mobile and networking chips. 0269 um 2, slightly smaller than TSMC’s published 7nm cell, while Intel reported a . Chairman Morris Chang's report, sent to shareholders, said that Cadence provides a fully integrated digital flow from implementation to final signoff that has been certified by TSMC for the latest versions of the 5nm and 7nm+ processes. 6X Compared to its 10nm FinFET process, TSMC’s 7nm FinFET features 1. 5 at 14nm [1]. Particularly TSMC, who would have been GF's primary competitor in 7nm, simply won't have the capacity AMD needs to spare when Apple, Nvidia, Qualcomm and a whole lot of other companies will all be fighting for their capacity. At this point, TSMC and GloFo actually seem to be having slightly lower transistor density at respective 7 nm processes than Intel at 10 nm. 027 mm2 with Jun 25, 2018 Papers from IEDM in December 2017, VLSIT this month, the TSMC and because it is similar in density to the competing "7nm" processes. By Dick James. Those are not good news for consumers in a long therm. 127mm^2 in TSMC's 28nm process and 0. 14 > 12/10 > 7. 3x routed gate density increase compared to TSMC's 16FF+ process now in volume production. Cadence announced its continued work with TSMC to certify its solutions for TSMC 5nm and 7nm+ FinFET process technologies for mobile and HPC designs. The delays in getting EUV ready for mass production have caused many large fabs, such as TSMC and GloFo, to rely on traditional methods for their 7nm processes – a process node previously touted TSMC said its 7nm Fin Field-Effect Transistor (FinFET) process technology has "the most competitive logic density" in the industry and "sets the pace for 7nm process technology development" by TSMC 7nm is the first time when they have a high performance process version which will provide 15% higher transistor performance than standard 7nm version which would be mobile optimized. TSMC also unveiled some low power and low leakage processes that are suitable for Apple's other custom designs, such as its line of wireless chips like the W1 and successor W2. 10nm-7nm: Intel will have a solid density lead of about >= 1. The abstract echoed claims for the 7nm node that TSMC first made at an event here in September. Compared to the 16nm FF process, TSMC’s 7nm process (code N7) performance increased by 35%, energy consumption reduced by 65%, and triple the transistor density. TSMC's 12nm process has the same overall density as it's 16nm process and both of those are 40% Enhancements made for the 7nm process include advanced device snapping and an accelerated custom placement and routing flow that enables customers to improve productivity and meet power, multiple patterning, density and EM requirements. “Broadcom and TSMC have driven unparalleled silicon innovation over the last decade. According to senior officials at TSMC during the Semicon expo in Taiwan this week, the chip fabrication giant is on track to begin volume production on its 7nm process node in Q1 2018. Taiwan Semiconductor Manufacturing Co. It is expected to start production in 2019 and mass production in 2020. They can leverage production learning on the healty baseline of N7. • Contact resistance optimization and side wall spacer k value reduction. 7nm will be in high demand, and TSMC is pretty much the world's only supplier. 0 Paper #2. 6X logic density, ~20% speed improvement, and ~40% power reduction. Cadence has taped out its flagship DDR4 PHY using the 7nm process node in Q4 2016, and key customers have integrated the 7nm DDR PHYs into their enterprise-class SoCs. This 7nm technology refers to the density of transistors on a density of the 7nm FinFET technology node is analyzed and compared with the state-of-the-art 45nm CMOS technology node for different circuits. The chips used in this process include Apple A12, Hisilicon Kirin 980, AMD and NVIDIA’s 7nm CPU/GPU chips. ) to win new business," according to Priestly. So in practice glofo 14nm and tsmc 16nm++ densities are very similar, we could genuinely be seeing around triple transistor density for 7nm GPUs which is insane. When being the best isn't good enough: Qualcomm goes with Samsung. As for Intel their largely accepted equivalent to other foundries' 7nm is their 10nm, which is introduced in Cannon Lake/Ice Lake. 0269 square microns. I am looking forward to see how TSMC 7nm HP , GF 7nm HP and Intel 10nm fare and the face off between CPUs from Intel 10nm and AMD built at GF 7nm in 2019. TSMC’s 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry’s most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM with double-digit yields in June 2016. TSMC’s breakthrough this year is chips with a 7nm process, down from 10nm. Cadence also For some perspective, TSMC says its 7nm technology offers 0. Taiwan Semiconductor Manufacturing Company ("TSMC") has quickly become a household name in the chip fabrication business, and the foundry of choice for many fabless chip makers. Worsen writability but actually also density loss (compared to if the M0 R was much lower) due to the The 7nm IP platform includes a 56G long-reach SerDes, TCAM, HBM2 PHY, high-speed fast cache, single-port and dual-port SRAMs and many high-speed, high-density multi-port memory architectures. Taiwan Semiconductor Manufacturing Company (TSMC) has revised its plans to bring 7nm chip mass production forward reports DigiTimes. The node should provide up to a 40% speed gain, a 65% power reduction, and a 3. For design for manufacturing (DFM), Mentor added color-aware fill and more sophisticated alignment and spacing rules to the SmartFill feature of the Calibre YieldEnhancer tool. TSMC and GF already start mass production of 7nm and by the look of it their yield also pretty high while Intel still can't figure out 10nm and their yield also still pretty bad by the look of it. 0 80% 2. 6 [1], TSMC announced the “world’s first 7nm CMOS platform technology for mobile system-on-a-chip (SoC) applications, featuring FinFET transistors”. TSMC and Cadence have collaborated on an integrated flow based on tool certification targeting TSMC's 7nm mobile and HPC platforms. TSMC . 8x greater than at the foundry's 40-nm node, said TSMC. TSMC said that the 5nm process will reduce power consumption by 20% compared to the initial 7nm process technology, transistor density will be increased by 1. Not all processes are the same or equal. The process delivers 40% power efficiency and 37% area reduction For more than a decade, if you wanted cutting-edge foundry technology, TSMC was the only game in town. 6X logic density, ~20 percent speed improvement, and ~40 percent power reduction. Compared with the 7nm process, TSMC’s 5nm process can reduce energy consumption by 20%, transistor density by 1. Arnaud (IBM alliance), 2009 IEDM, p. 10nm-7nm: Intel will have a solid density lead of about >= 1. Wu et al, TSMC. In a nutshell, AMD will be releasing 7nm Zen 2 CPU and Navi GPU From a general PPA (power, performance, area) improvement point of view, TSMC expects its CLN7FF+ to offer a 20% higher transistor density and a 10% lower power consumption at the same complexity and frequency when compared to the CLN7FF. The process will deliver more than three times the gate density and either a speed gain (35-40%) or power reduction (>65%) versus the company s commercial 16nm FinFET process, the abstract said. Lisa Su revealing their first 7nm GPU at Computex 2018. BJ Woo, vice president of business development at TSMC. If you go for the maximum density option, which small mobile processors tend to use. Intel's 10nm doesn't use EUV and will have worse density than TSMC 7nm. TSMC 16nm is Just the Beginning AL faster, power is 45% less, gate density 2. The company is confident that this smaller process node will provide them with increased silicon density and reduced power consumption. From the AMD Teleconference Lisa Su was asked about the confidence AMD has with TSMC as a supplier of the 7nm Epyc products. Lisa responded that AMD would use both TSMC and Global Foundries for it 7nm products and TSMC would go first. 027 mm2 with Apr 17, 2018 In the meantime, TSMC forged ahead with its 7nm technology, which that the foundries' 7nm technologies are close to Intel's 10nm in density In semiconductor manufacturing, the International Technology Roadmap for Semiconductors In March 2017, TSMC announced 7 nm with EUV (N7FF+) risk production starting . The integrated flow ensures that the certified tools work seamlessly when used together. The ability to lay down a 7nm line doesn’t mean that transistor density will equal a 7nm process. Based on PPASC metrics and the cost-per-transistor curve, 7nm looks like a better option, at least according to some. Along with the updated 7nm+ process, the company is also planning out their Enhancements made for the 7nm process include advanced device snapping and an accelerated custom placement and routing flow that enables customers to improve productivity and meet power, multiple patterning, density and EM requirements. Further collaborations, anchored around the Design Compiler Graphical and IC Compiler II digital implementation products, have supported TSMC’s High Performance Compute (HPC) methodology to mutual customers for the 7nm node that is proven to deliver broad performance gains aimed at compute-intensive designs. TSMC will be first to 7 nm. 0260 to 0. TSMC TSMC's 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry's most competitive logic density and sets the industry pace for 7nm Jul 20, 2018 7nm is TSMC's fourth generation process node that uses 3D FinFET In addition, this technology improves logic density by more than three TSMC detailed its 7-nm advances over its 16FF+ process (Images: IEDM). 5nm and 7nm+ Digital and Signoff Tool Certification. This is a measurement of the distance between components of the processor. 2x as dense as 16nm (and both TSMC and GloFo's 7nm are extremely close to each other). e. They claimed the world’s smallest-ever SRAM cell at 0. TSMC 5nm will again beat Intel and Samsung 7nm in 2019 so the leap frogging continues. Moreover, back in 2016, Samsung told us EUV at 7nm was done, among many other reasons, in order to avoid quad patterning. Our work with TSMC on their 7nm node has gone very well and we have seen excellent results from early silicon," Papermaster added. 0312μm²; in contrast, Samsung and TSMC have reported 7nm bitcell sizes of 0. but last year, estimated for Apple’s SoC density was well over what the indistry was doing, including that of other TSMC customers. TSMC already has agreements to fabricate chips using the 7nm process with dozens of customers, with agreements confirmed for gaming, graphics cards, and processors. From TSMC’s disclosure about transistor density, the projected transistor density for 5nm is much higher as compared to Intel’s 10nm. Michael compared the technology to 16FF+, not to 10nm. Intel's 10nm process is 10% denser than both GF and TSMC's 7nm process and double Samsung's 10nm. The truth is that Intel is stagnating behind and is losing its manufacturing lead to rivals [2]. Intel's 10nm process should (but might not) have higher component density than its 14nm, but Samsung/TSMC's 7nm isn't necessarily more dense than Intel's 10nm. 2nm standard node) • Hard to scale performance. 027um^2, roughly a 2. I believe TSMC will use 7nm for some memory and mobile applications. Rethink Technology business briefs for 7nm Provides the Industry's Most Competitive Speed, Power Reduction, and Logic Density Compared to TSMC's 16nm FinFET Plus (16FF+) technology, TSMC's 7nm technology delivers around 35% speed gain at the same power, or around 65% power reduction at the same speed. Moreover, Intel and Qualcomm have more than one processor variations for different markets vs Apple,Huawei has one/two processor for phones/tablets. org]. Intel's 10nm and TSMC's 7nm is similar so soon as Intel releases 10nm in mass production middle of next year, and Qualcomm moves to 7nm than all same unless TSMC moves to 5nm end of 2019. In GF marketspeak, that would likely be a 3. Currently, TSMC's new 7nm chips deliver 35 percent more speed or uses 65 percent less power and sports a 3x gain in routed gate density. Smaller process sizes tend to lower costs whilst increasing density, which port-density applications • Symmetric floorplan allows north-south and east-west SoC orientation • Comprehensive on-chip diagnostic features make system testing/debugging quick and easy Features • TSMC 7nm FinFET CMOS Process • 112/56Gbps PAM-4 or 56/28/10Gbps NRZ data rates • Power-optimized for LR and MR links In 2019, 7nm is said to make up over 20% of TSMC's revenues, with the company being set to fully utilise their manufacturing technology with product designs from AMD, Apple, Qualcomm, Nvidia and a long list of other companies. Cadence delivered several custom/analog enhancements specifically to support the TSMC 5nm and 7nm+ process technologies. 8x higher than that of N7), increase frequency by 15% (at the same complexity and power) or reduce power consumption by 20% power reduction (at the same frequency and complexity). CEO Robert Blake (pictured) agrees that all the makings of a TSMC also said earlier this month that its chip manufacturing process using EUV technology will be the “most advanced technology in foundry industry” in 2018 in terms of density, performance It is reported that Huawei cooperated with TSMC in 2015 to develop a 7nm process processor. The Zen 2 CPU chiplets themselves will be built on the new TSMC 7nm process node, but the I/O die, the part that handles all the inputs and outputs for the processor silicon, will be built using the existing, stable 14nm lithography. The choices are complicated as chipmakers release a range of half nodes. • GlobalFoundries skipped 10nm and is moving to 7nm. First up, the company has successfully taped out its first customer chip using its second-generation 7 nm process technology, which incorporates limited EUVL usage. Enhancements made for the 7nm process include advanced device snapping and an accelerated custom placement and routing flow that enables customers to improve productivity and meet power, multiple patterning, density and EM requirements. Intel shares fell 0. 3X density improvement, according to Gartner. 27 µm 2 , and 3x the gate density of the 16-nm (16 FF+) process, together with a 35 – 40% speed gain or over 65% power So back to GF and the 7nm process. “TSMC appears to be winning most of the leading-edge design wins due to better 7nm process technology performance, lower power consumption and better area density,” he told EE Times. 5nm node, call it 3nm to make it sound better. 15, 2016 – ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs. TSMC's 7nm technology development leverages our 10nm development very effectively. 0312 um 2 cell size for its 10nm process. Both Samsung and TSMC will apply EUV probably only to two chip layers at 7nm, so far not using protective pellicles that are still in development, said Handel Jones, president of International Business Strategies. Apple partner TSMC begins mass production of 7nm processors for next-generation iPhone. 5 at 14nm [1]. According to TSMC, their 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry's most competitive logic density and sets the industry pace for 7nm process technology development by delivering 256Mb SRAM with double-digit yields in June 2016. 21, 2017 (GLOBE NEWSWIRE) -- Broadcom Limited (NASDAQ:AVGO), a leading designer, developer and global supplier of a That depends on the actual node densities though, Samsung 10nm node density was 51. Compared to 16nm/14nm, 7nm provides a 35% speed improvement, 65% less power, and a 3. 243 28nm: F. 9% to $47. The above figure shows the high-density SRAM bitcell sizes reported by Intel since the 90nm technology node. For the same performance level, power is reduced by about 50 percent, or, conversely, at the same power consumption, performance is increased by about 25 percent. 07um^2). Intel's 10nm process (if they can ever get it working reliably) yields about 101 million transistors per mm^2 [wikipedia. It’s more likely that it’s closer to a real 10-12nm process in density. Y. High density SRAM cell is 0. Brief summary/comparison of TSMC and Samsung EUV 7nm processes You are currently viewing SemiWiki as a guest which gives you limited access to the site. TSMC TSMC's 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry's most competitive logic density and sets the industry pace for 7nm Jun 25, 2018 Papers from IEDM in December 2017, VLSIT this month, the TSMC and because it is similar in density to the competing "7nm" processes. density and EM requirements. Foundry Competition - Samsung 14nm vs. By Mikey Campbell Tuesday, May 22, 2018, 08:13 pm PT (11:13 pm ET) Apple's system-on-chip manufacturing On 7nm, the same 256b M0 bitline is at > 1000 Ω. 2 times increase in logic density, 10% more performance, or 15% lower power than the 7nm technology that'll go into production next year. 14^2 = 196, 7^2 = 49. Topic Posted By Date; TSMC started fabbing Apple's 7nm A12, Samsung confirms 7nm start this year: AM: 2018/05/24 04:08 AM Pick a number, any number at all A 7nm, they could not compete with TSMC which had a head start thanks to their higher 7nm wafter production capacity. AMD CEO Lisa Su has confirmed that they will be using both TSMC and GlobalFoundries for their next generation 7nm Vega and Zen 2 products. From a general PPA (power, performance, area) improvement point of view, TSMC expects its CLN7FF+ to offer a 20% higher transistor density and a 10% lower power consumption at the same complexity and frequency when compared to the CLN7FF. What is it? Lets start with the money quote from the official press release, “ GLOBALFOUNDRIES’ new 7nm FinFET technology is expected to deliver more than twice the logic density and a 30 percent performance boost compared to today’s 16/14nm foundry FinFET offerings. • Short lived half node for TSMC. Point-to-point and current density reliability checks are critical for today's complex, dense chip designs, but completing these checks on very large 12nm and 7nm FinFET Plus designs requires Transistor density at N7 is 16. In May of 2017, Intel's Technology and Manufacturing Group Director, Mark Bohr, confirmed that Intel was already started researching their 5 nm node as their 7nm was already in development phase. "We made a bet on 7nm," Su said. TSMC co-CEO Mark Liu recently told investors that the company will have a trial production run using 7nm process technology in the first half of 2017. • Scaling will provide density and performance advantages. TSMC claims that compared to its 10nm FinFET process, TSMC's 7nm FinFET features 1. For fast, accurate circuit simulation, TSMC certified the AFS platform, including the AFS Mega circuit simulator, for 10nm V1